[1]曹旭东,孙云龙,孔阳.基于ARM11的高速PCB设计技术的研究及实现[J].应用科技,2016,(01):22-26.[doi:10.11991/yykj.201503012]
 CAO Xudong,SUN Yunlong,KONG Yang.Research and implementation of high-speed PCB design technology based on ARM11[J].yykj,2016,(01):22-26.[doi:10.11991/yykj.201503012]
点击复制

基于ARM11的高速PCB设计技术的研究及实现(/HTML)
分享到:

《应用科技》[ISSN:1009-671X/CN:23-1191/U]

卷:
期数:
2016年01期
页码:
22-26
栏目:
现代电子技术
出版日期:
2016-02-05

文章信息/Info

Title:
Research and implementation of high-speed PCB design technology based on ARM11
作者:
曹旭东12 孙云龙1 孔阳1
1. 中国石油大学(北京)信息工程学院 北京 102249;
2. 南京浩仕康石油设备有限公司 江苏 南京 210000
Author(s):
CAO Xudong12 SUN Yunlong1 KONG Yang1
1. Information Engineering College of China University of Petroleum, Beijing 102249, China;
2. Nanjing HaoShiKang Petroleum Equipment Co., Ltd., Nanjing 210000, China
关键词:
嵌入式处理器高速PCB信号完整性抑制噪声可靠性
Keywords:
embedded processorhigh-speed PCBsignal integritynoise suppressionreliability
分类号:
TN402
DOI:
10.11991/yykj.201503012
文献标志码:
A
摘要:
介绍了一种基于嵌入式处理器S3C6410的高速印制电路板设计技术。通过对高速电路产生电磁干扰、反射、振铃和串扰等信号完整性问题的原理进行分析,提出削弱或消除以上噪声的方法。采用Mentor Graphics公司的PADS软件绘制电路原理图和PCB,借助该公司的HyperLynx仿真软件进行前端LineSim和后端BoardSim可靠性验证。设计的电路板通过电磁兼容测试,表明该方法能够有效抑制噪声,增强高速数字电路设计的稳定性,提高产品设计的成功率。
Abstract:
Research and realization of high-speed PCB(printed circuit board) design technology based on embedded processor S3C6410 is introduced in this paper.By analyzing the principles of signal integrity problems generated by high-speed circuit such as electromagnetic interference(EMI),reflections,ringing and crosstalk,the paper proposes the method to weaken or eliminate the above noise.The schematics and PCB were drawn by using PADS software.The reliability of the design was verified by the simulation software HyperLynx,including the font-end LineSim and back-end BoardSim.The electromagnetic compatibility test shows that this method can suppress noise effectively,enhance the reliability of high-speed digital circuit design,and increase the success rate of product design.

参考文献/References:

[1] BOGATIN E.信号完整性分析[M].李玉山,李丽平,译.北京:电子工业出版社,2006:6-127.
[2] 邵鹏.信号/电源完整性仿真分析与实践[M].北京:电子工业出版社,2013:90.
[3] 曾峰,巩海洪,陈洪霞.PADS 9.0高速电路PCB设计与应用[M].北京:电子工业出版社,2010:347-400.
[4] 周润景,景晓松,赵俊奇.OrCAD & PADS高速电路板设计与仿真[M].北京:电子工业出版社,2007:531.
[5] 姜宏丰.高速PCB电路中噪声抑制的分析与研究[D].西安:西安电子科技大学,2014:12-15.
[6] 李颖宏,罗勇.PCB设计中同步开关噪声问题分析[J].电讯技术,2012,52(3):395-399.
[7] TANG Zhanghong.Hotspot detection by improved adaptive finite element method and its application in high-speed PCB and IC package design[J].IEEE transactions on components,packaging and manufacturing technology,2012,2(2):1659-1665.
[8] 满宇航,魏金军,马永光.配网自动化仿真系统智能重合器与分段器设计[J].电力科学与工程,2012,27(12):40-44.
[9] 倪胜.ARM11高速电路设计与仿真[D].武汉:华中师范大学,2012:16-17.
[10] 朱亚地.高速PCB信号反射及串扰仿真分析[D].西安:西安电子科技大学,2012:30-32.
[11] 李程贵,张学谦,马德华,等.基于ARM9的智能家居网关的设计[J].科技创新导报,2011(15):20.

备注/Memo

备注/Memo:
收稿日期:2015-03-17;改回日期:。
作者简介:曹旭东(1968-),男,副教授;孙云龙(1987-),男,硕士研究生.
通讯作者:孙云龙,男,E-mail:cupsunyunlong188@sina.com.
更新日期/Last Update: 2016-02-17