[1]周壮,周继承,王云云,等.多芯片COB封装LED的基板温度分布[J].应用科技,2016,(02):1-4.[doi:10.11991/yykj.201511012]
 ZHOU Zhuang,ZHOU Jicheng,WANG Yunyun,et al.Temperature distribution of multi-chip COB LED package substrate[J].yykj,2016,(02):1-4.[doi:10.11991/yykj.201511012]
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多芯片COB封装LED的基板温度分布(/HTML)
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《应用科技》[ISSN:1009-671X/CN:23-1191/U]

卷:
期数:
2016年02期
页码:
1-4
栏目:
现代电子技术
出版日期:
2016-04-05

文章信息/Info

Title:
Temperature distribution of multi-chip COB LED package substrate
作者:
周壮 周继承 王云云 黄金惠
中南大学能源科学与工程学院, 湖南长沙 410083
Author(s):
ZHOU Zhuang ZHOU Jicheng WANG Yunyun HUANG Jinhui
School of Energy Science and Engineering, Central South University, Changsha 410083, China
关键词:
发光二极管芯片板上贴装基板温度分布数值模拟
Keywords:
LEDCOBsubstratetemperature distributionnumerical simulation
分类号:
TN3
DOI:
10.11991/yykj.201511012
文献标志码:
A
摘要:
发光二极管(LED)的工作温度对其性能和寿命有很大影响,对于多芯片板上贴装(COB)的LED面光源,还存在基板温度分布不均匀的问题。基于一款多芯片COB封装LED的封装基板,用ANSYS仿真分析软件模拟其温度场,并证实了模拟的可靠性,探讨了基板表面和厚度方向的温度分布情况,对比了铝基板和铜基板的温度场。结果表明,多芯片COB封装LED的基板温度分布在芯片集中区存在很大的不均匀性,而基板边缘区温度则基本均匀,用铜基板代替铝基板,可以降低基板温度,且芯片集中区基板温度梯度也减小,铜基板整体的温度分布均匀性要好于铝基板。
Abstract:
The working temperature of a light-emitting diode (LED) has a significant impact on its performance and lifetime. For multi-chip on board (COB) LED area illuminant, the non-uniform temperature distribution of package substrate is being concerned. This paper tries to solve the problem of multi-chip COB LED package substrate. The temperature distribution was simulated using the software ANSYS, and the reliability was verified by tested data. The temperature distributions on the substrate surface and in the thickness direction were discussed, respectively, and the temperature field of the aluminum substrate and that of copper substrate were compared. The results show that the temperature distribution of the chip concentration area on the package substrate is very uneven, whereas the temperature distribution in the edge region of the substrate is basically uniform. Substituting the aluminum substrate for copper substrate, the substrate temperature can be reduced, and the temperature gradient of the package substrate in the chip concentration area is also reduced; meanwhile the temperature uniformity of the copper substrate on the whole is better than that of the aluminum substrate.

参考文献/References:

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备注/Memo

备注/Memo:
收稿日期:2015-11-16;改回日期:。
基金项目:长沙市科技计划重点项目(k1403017-11).
作者简介:周壮(1989-),男,硕士研究生;周继承(1963-),男,教授,博士.
通讯作者:周继承,E-mail:jicheng@csu.edu.cn.
更新日期/Last Update: 2016-04-07